Title ZINC-INDIUM-MAGNESIUM active solder
Basic technology outline Active leadless solder for higher application temperatures

Active soft leadless solder on Zn-In base with Mg addition

Allows direct soldering non-metalic materials without previous coating

Solder is designed for higher application temperatures (∼300 °C)

The wetting speed, the area of spread, the contact angle and the shear strenght of bonds are on standard industrial level

Technology deployment Direct soldering of metallic and non-metallic materials

Usable in electronics, energy industry, research and development

Allows direct soldering metallic materials with non-metallic or special materials (like tungsten)

Primary designed for ultrasound, laser and combined soldering

Usable in sequent soldering process

Suitable for soldering without flux

Advantages over currently used solutions Unique combination of features and use possibilities

Does not contain Pb (harmful) and Au (costly)

Suitable for higher application temperatures – unique atribute for active leadless solders

Better mechanical characters in comparison with solders containing Bi

Current status of technology Patented and tested technology

(Slovak) patent pending (5011-2016)

Tested in relevant conditions

Conducted and analyzed solded bonds between Si,

Al2O3, Cu and others

More information alena.kojdiakova@cvtisr.sk
Project co-funded by European Union funds (ERDF and IPA)