| Title | ZINC-INDIUM-MAGNESIUM active solder |
| Basic technology outline | Active leadless solder for higher application temperatures
Active soft leadless solder on Zn-In base with Mg addition Allows direct soldering non-metalic materials without previous coating Solder is designed for higher application temperatures (∼300 °C) The wetting speed, the area of spread, the contact angle and the shear strenght of bonds are on standard industrial level |
| Technology deployment | Direct soldering of metallic and non-metallic materials
Usable in electronics, energy industry, research and development Allows direct soldering metallic materials with non-metallic or special materials (like tungsten) Primary designed for ultrasound, laser and combined soldering Usable in sequent soldering process Suitable for soldering without flux |
| Advantages over currently used solutions | Unique combination of features and use possibilities
Does not contain Pb (harmful) and Au (costly) Suitable for higher application temperatures – unique atribute for active leadless solders Better mechanical characters in comparison with solders containing Bi |
| Current status of technology | Patented and tested technology
(Slovak) patent pending (5011-2016) Tested in relevant conditions Conducted and analyzed solded bonds between Si, Al2O3, Cu and others |
| More information | alena.kojdiakova@cvtisr.sk |
| Notice |
Project co-funded by the European Union funds (ERDF and IPA) |
