Direct soldering by means of an active metal interlayer

Title Direct soldering by means of an active metal interlayer
Basic technology outline Direct soldering by common solder and active metal interlayer

A direct soldering process utilizing a combination of conventional solder and interlayer of active metal (Ti, Mg. Zr, Hf, Cr, La, Y, Ce, Pr)

Allows direct soldering of non-metallic materials without their prior plating and without the use of active solders

Technology deployment Soldering of metallic materials with non-metallic

Usable in the fields of vacuum technology and other laboratory techniques, electrical engineering, research and development.

Allows direct soldering of metallic materials with non-metallic or difficult to solder materials

Designed for ultrasonic or vacuum soldering

Suitable for the manufacture of products based on metals, technical ceramics, glass and other nonmetallic materials

Advantages over currently used solutions Usable for all application temperatures

Allows use of common solders (Sn, Sn+Ag, others) with non-metallic soldering

Suitable for all application temperatures and large amount of materials – by the combination of solder and active metal used

does not require special processing of soldered materials

Current status of technology Patented and tested technology

(Slovak) patent pending No. 50086-2016

Successfully tested under relevant conditions

Realized and analyzed were solder joints formed between the materials: Cu a Si, SiC, Al2O3, SiO2, C (graphite) and others

More information
Project co-funded by European Union funds (ERDF and IPA)