| Title | Direct soldering by means of an active metal interlayer |
| Basic technology outline | Direct soldering by common solder and active metal interlayer
A direct soldering process utilizing a combination of conventional solder and interlayer of active metal (Ti, Mg. Zr, Hf, Cr, La, Y, Ce, Pr) Allows direct soldering of non-metallic materials without their prior plating and without the use of active solders |
| Technology deployment | Soldering of metallic materials with non-metallic
Usable in the fields of vacuum technology and other laboratory techniques, electrical engineering, research and development. Allows direct soldering of metallic materials with non-metallic or difficult to solder materials Designed for ultrasonic or vacuum soldering Suitable for the manufacture of products based on metals, technical ceramics, glass and other nonmetallic materials |
| Advantages over currently used solutions | Usable for all application temperatures
Allows use of common solders (Sn, Sn+Ag, others) with non-metallic soldering Suitable for all application temperatures and large amount of materials – by the combination of solder and active metal used does not require special processing of soldered materials |
| Current status of technology | Patented and tested technology
(Slovak) patent pending No. 50086-2016 Successfully tested under relevant conditions Realized and analyzed were solder joints formed between the materials: Cu a Si, SiC, Al2O3, SiO2, C (graphite) and others |
| More information | alena.kojdiakova@cvtisr.sk |
3 Comments
Andrea · 25. October 2017 at 15:02
to stress the “eco”-related aspect in your invention I recommend cooperation with a metal-recycling company (so that the required metals is not from primary material resources). Or even better, with an institution engaged in phytoremediation. If the metal you used originated from previously metal-contaminated soils or water sites, you and your partner institution would kill two birds with one stone: coupling innovative production with environmental clean-up.
see: https://www.ncbi.nlm.nih.gov/pubmed/25700109
Alena Kojdiakova · 26. October 2017 at 7:35
Thank you very much for your comment, we will send it to our partner institution.
Andrea · 7. November 2017 at 11:09
Hi Alena,
nice to see your communication device is functional!